- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/74 - Means for mounting coupling parts to apparatus or structures, e.g. to a wall for mounting coupling parts in openings of a panel
Patent holdings for IPC class H01R 13/74
Total number of patents in this class: 1127
10-year publication summary
115
|
105
|
84
|
116
|
106
|
107
|
110
|
74
|
63
|
31
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Yazaki Corporation | 6282 |
109 |
Sumitomo Wiring Systems, Ltd. | 9367 |
93 |
Phoenix Contact GmbH & Co. KG | 2202 |
27 |
TE Connectivity Solutions GmbH | 2580 |
24 |
Sumitomo Electric Industries, Ltd. | 14131 |
19 |
AutoNetworks Technologies, Ltd. | 5809 |
19 |
Apple Inc. | 50209 |
16 |
HARTING Electric GmbH & Co. KG | 437 |
16 |
Japan Aviation Electronics Industry, Limited | 1585 |
16 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
15 |
Tyco Electronics Corporation | 792 |
13 |
Hubbell Incorporated | 3052 |
12 |
CommScope Technologies LLC | 4937 |
12 |
Foxconn Interconnect Technology Limited | 1034 |
12 |
Titan3 Technology LLC | 173 |
12 |
Robert Bosch GmbH | 40953 |
11 |
Neutrik AG | 197 |
11 |
Molex, LLC | 1792 |
10 |
Samsung Electronics Co., Ltd. | 131630 |
8 |
Arlington Industries, Inc. | 242 |
8 |
Other owners | 664 |